JPH0399444U - - Google Patents

Info

Publication number
JPH0399444U
JPH0399444U JP1990007715U JP771590U JPH0399444U JP H0399444 U JPH0399444 U JP H0399444U JP 1990007715 U JP1990007715 U JP 1990007715U JP 771590 U JP771590 U JP 771590U JP H0399444 U JPH0399444 U JP H0399444U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor chip
punch
fitting hole
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990007715U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0636586Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990007715U priority Critical patent/JPH0636586Y2/ja
Publication of JPH0399444U publication Critical patent/JPH0399444U/ja
Application granted granted Critical
Publication of JPH0636586Y2 publication Critical patent/JPH0636586Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
JP1990007715U 1990-01-30 1990-01-30 半導体チップ塔載用ヒートシンクテープ構造 Expired - Lifetime JPH0636586Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990007715U JPH0636586Y2 (ja) 1990-01-30 1990-01-30 半導体チップ塔載用ヒートシンクテープ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990007715U JPH0636586Y2 (ja) 1990-01-30 1990-01-30 半導体チップ塔載用ヒートシンクテープ構造

Publications (2)

Publication Number Publication Date
JPH0399444U true JPH0399444U (en]) 1991-10-17
JPH0636586Y2 JPH0636586Y2 (ja) 1994-09-21

Family

ID=31511369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990007715U Expired - Lifetime JPH0636586Y2 (ja) 1990-01-30 1990-01-30 半導体チップ塔載用ヒートシンクテープ構造

Country Status (1)

Country Link
JP (1) JPH0636586Y2 (en])

Also Published As

Publication number Publication date
JPH0636586Y2 (ja) 1994-09-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term